 
Hello! My name is Jiyoon Choi from South Korea.
(E-mail: choi.jiyoon.t3@s.mail.nagoya-u.ac.jp)
はじめまして!私はジユンチョイと申します。韓国人です。
よろしくお願いします!
My research interests include SiC power module packaging and thermal management in power electronics.
[1] “SiC Power Module with a Low Permittivity Material to Reduce Common Mode Noise”
Jiyoon Choi,Sihoon Choi, Jong-Won Shin, Yu Yonezawa, Arihiro Kamiya, Jun Imaoka, and Masayoshi Yamamoto The Japan Institute of Electronics Packaging (JIEP) – 37th JIEP Spring Conference (第37回エレクトロニクス実装学会春季講演大会), Keio Univ., Yokohama, Japan, Mar. 2023.
[2] “Analysis of Novel Heatsink Implemented in the Power Module of Automotive Traction Inverter”
Jiyoon Choi,Thiyu Warnakulasooriya, Sihoon Choi, Jun Imaoka, and Masayoshi Yamamoto, The Japan Institute of Electronics Packaging (JIEP) – 38th JIEP Spring Conference (第38回エレクトロニクス実装学会春季講演大会), 13B1-4, Tokyo Univ. of Science Noda Campus, Chiba, Japan, Mar. 2024.
[1]”A Review of BMW iX3 Power Module – Part 2: Stacked-Plate Fin Heatsink Structure,”
Jiyoon Choi, hiyu Warnakulasooriya, Sihoon Choi, Arihiro Kamiya, Jun Imaoka, and Masayoshi Yamamoto, 2024 IEEE CPMT Symposium Japan (ICSJ), Kyoto, Japan, 2024.
[2]”Low Loop Inductance in Power Semiconductor Module with Direct-Lead Bonded Busbar,”
Jiyoon Choi, Sihoon Choi, Jun Imaoka and Masayoshi Yamamoto, The 37th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2025), Kumamoto, Japan, 2025.