Choi Jiyoon

自己紹介/Self Introduction

Hello! My name is Jiyoon Choi from South Korea.

(E-mail: choi.jiyoon.t3@s.mail.nagoya-u.ac.jp)

はじめまして！私はジユンチョイと申します。韓国人です。

よろしくお願いします！

研究内容/RESEARCH CONTENT

My research interests include SiC power module packaging and thermal management in power electronics.

論文/PUBLICATION

Domestic Conference

[1] “SiC Power Module with a Low Permittivity Material to Reduce Common Mode Noise” Jiyoon Choi, Sihoon Choi, Jong-Won Shin, Yu Yonezawa, Arihiro Kamiya, Jun Imaoka, Masayoshi Yamamoto The Japan Institute of Electronics Packaging (JIEP) – 37th JIEP Spring Conference (第37回エレクトロニクス実装学会春季講演大会), Keio Univ., Yokohama, Japan, Mar. 2023.

[2] “Analysis of Novel Heatsink Implemented in the Power Module of Automotive Traction Inverter”, Sihoon Choi, Jiyoon Choi, Thiyu Warnakulasooriya, Sihoon Choi, Jun Imaoka, and Masayoshi Yamamoto, The Japan Institute of Electronics Packaging (JIEP) – 38th JIEP Spring Conference (第38回エレクトロニクス実装学会春季講演大会), 13B1-4, Tokyo Univ. of Science Noda Campus, Chiba, Japan, Mar. 2024.

[3] “Packaging and Manufacturability of Low Capacitive Coupling SiC Power Module with Low Permittivity Material”, Sihoon Choi, Jiyoon Choi, Jong-Won Shin, Jun Imaoka, and Masayoshi Yamamoto, The Japan Institute of Electronics Packaging (JIEP) – 38th JIEP Spring Conference (第38回エレクトロニクス実装学会春季講演大会), 13B1-4, Tokyo Univ. of Science Noda Campus, Chiba, Japan, Mar. 2024.

International Conference

[1]“Packaging of SiC Power Module with a Low-Permittivity Material to Reduce Capacitive Coupling” Sihoon Choi, Jiyoon Choi, Jong-Won Shin, Jun Imaoka, and Masayoshi Yamamoto12th IEEE Components, Packaging, and Manufacturing Technology Symposium Japan – ICSJ, Ritsumeikan Univ., Kyoto, Japan, Nov. 2023.

[2]“Design and Packaging Method of SiC Power Module to Attenuate Common-Mode Noise” Sihoon Choi, Jiyoon Choi, Yu Yonezawa, Jong-Won Shin, Jun Imaoka, and Masayoshi Yamamoto International Conference on Materials and Systems for Sustainability – ICMaSS, Nagoya Univ., Naogya, Japan, Dec. 2023.

[3] “SiC Power Module Design with a Low-Permittivity Material to Reduce Common-Mode Noise” Sihoon Choi, Jiyoon Choi, Yu Yonezawa, Jong-Won Shin, Jun Imaoka, and Masayoshi Yamamoto IEEE Applied Power Electronics Conference and Exposition – APEC, Long Beach, CA, USA, Feb. 2023.