Choi Jiyoon
自己紹介/Self Introduction
Hello! My name is Jiyoon Choi from South Korea.
(E-mail: choi.jiyoon.t3@s.mail.nagoya-u.ac.jp)
はじめまして！私はジユンチョイと申します。韓国人です。
よろしくお願いします！
研究内容/RESEARCH CONTENT
- ・Power module packaging
- ・Thermal management (Heatsink design)
論文/PUBLICATION
Domestic Conference Papers
[1] “SiC Power Module with a Low Permittivity Material to Reduce Common Mode Noise”
Jiyoon Choi,Sihoon Choi, Jong-Won Shin, Yu Yonezawa, Arihiro Kamiya, Jun Imaoka, and Masayoshi Yamamoto The Japan Institute of Electronics Packaging (JIEP) – 37th JIEP Spring Conference (第37回エレクトロニクス実装学会春季講演大会), Keio Univ., Yokohama, Japan, Mar. 2023.
[2] “Analysis of Novel Heatsink Implemented in the Power Module of Automotive Traction Inverter”
Jiyoon Choi,Thiyu Warnakulasooriya, Sihoon Choi, Jun Imaoka, and Masayoshi Yamamoto, The Japan Institute of Electronics Packaging (JIEP) – 38th JIEP Spring Conference (第38回エレクトロニクス実装学会春季講演大会), Tokyo Univ. of Science Noda Campus, Chiba, Japan, Mar. 2024.
[3] “Enhanced Heat Dissipation in Power Modules Using a Novel Stacked-Plate Heatsink Design”
Jiyoon Choi, Sihoon Choi, Jun Imaoka, and Masayoshi Yamamoto, 2025 IEE-Japan Industry Applications Society Conference (2025年電気学会産業応用部門大会), Tokushima University Josanjima Campus, Tokushima, Japan, Aug. 2025.
International Conference Papers
[1]”A Review of BMW iX3 Power Module – Part 2: Stacked-Plate Fin Heatsink Structure,”
Jiyoon Choi, Thiyu Warnakulasooriya, Sihoon Choi, Arihiro Kamiya, Jun Imaoka, and Masayoshi Yamamoto, 2024 IEEE CPMT Symposium Japan (ICSJ), Kyoto, Japan, 2024.
[2]”Low Loop Inductance in Power Semiconductor Module with Direct-Lead Bonded Busbar,”
Jiyoon Choi, Sihoon Choi, Jun Imaoka and Masayoshi Yamamoto, The 37th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2025), Kumamoto, Japan, 2025.
[3]”Stacked-Plate Heatsink Design for Effective Thermal Management of Power Semiconductor Modules,”
Jiyoon Choi, Sihoon Choi, Kazuhiro Umetani, Jun Imaoka and Masayoshi Yamamoto, 14th International Conference on Renewable Energy Research and Applications (ICRERA 2025), Vienna, Austria, 2025.
[4]”A Novel Stacked-Plate Heatsink Design for Enhanced Cooling in Power Semiconductor Modules,”
Jiyoon Choi, Sihoon Choi, Kazuhiro Umetani, Jun Imaoka and Masayoshi Yamamoto, International Conference on Materials and Systems for Sustainability 2025 (ICMaSS 2025), Nagoya, Japan, 2025.
[5]”Transfer-Molded Power Module for Low Common-Mode Capacitance and Enhanced Thermo-Mechanical Reliability,”
Jiyoon Choi, Thiyu Warnakulasooriya, Sihoon Choi, Jun Imaoka and Masayoshi Yamamoto, 2026 Applied Power Electronics Conference and Exposition (APEC 2026), San Antonio, TX, USA, 2026.
AWARD
[1] Best Presentation Award, 2026 Applied Power Electronics Conference and Exposition (APEC 2026), 2026